Why Two-Phase, Direct-to-Chip Cooling is Different
Two-phase cooling uses dielectric fluid inside a compact cold plate mounted directly on CPUs and GPUs. As heat is generated, the fluid boils and turns into vapor—holding the chip at a constant, predictable temperature, regardless of power.
This approach:
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Uses no water in the cold plate
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Eliminates hot spots through advanced wick-and-fin structures
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Scales naturally to higher-power AI chips
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Enables heat reuse and ultra-low PUE
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Built for AI Data Centers
Two-phase, direct-to-chip cooling supports:
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2500W+ AI accelerators
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PUE as low as 1.04
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Higher server density with lower maintenance
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Waterless, sustainable data center architectures
Go Deeper: How It Works
Learn how pool boiling, vapor transport, and closed-loop heat rejection work together to cool the world’s most powerful AI systems—without water.
Download the full article: Under the Hood: How Two-Phase, Direct-to-Chip Liquid Cooling Works